Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
For CVE-2024-43047, added to the catalogue on Oct 08, 2024 with a remediation deadline of Oct 29, 2024.
Available for technologies you monitor inside Seraph CTI.
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