Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
For CVE-2022-22071, added to the catalogue on Dec 05, 2023 with a remediation deadline of Dec 26, 2023.
Available for technologies you monitor inside Seraph CTI.
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